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C
HIVE INF
O
RMATI
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ARCHIVE INFORMATION
8
RF Device Data
Freescale Semiconductor
MRF9002NR2
PACKAGE DIMENSIONS
CASE 978-03
ISSUE C
PLASTIC
DIM
MIN MAX
MILLIMETERS
A
2.000
2.300
A1
0.025 0.100
A2
1.950 2.100
D
6.950 7.100
D1
4.372 5.180
E
8.850 9.150
E1
6.950 7.100
E2
4.372 5.180
L
0.466 0.720
L1
0.250 BSC
b
0.300 0.432
b1
0.300 0.375
c
0.180 0.279
c1
0.180 0.230
e
0.800 BSC
h
--- 0.600
0 7
aaa
0.200
bbb
0.200
ccc
0.100
NOTES:
1. CONTROLLING DIMENSION: MILLIMETER.
2. DIMENSIONS AND TOLERANCES PER ASME
Y14.5M, 1994.
3. DATUM PLANE -H- IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 PER SIDE. DIMENSIONS D AND E1 DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE -H-.
5. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION IS 0.127 TOTAL IN EXCESS OF THE
b DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. DATUMS -A- AND -B- TO BE DETERMINED AT
DATUM PLANE -H-.
BOTTOM VIEW
D1
E2
16
9
8
1
e/2
C
B
S
bbb
M
D
h
X 45
e
14 x
E1
8X
E
A
A2
C
SEATINGPLANE
H
DATUMPLANE
GAUGEPLANE
L1
1.000
0.039
L
W
W
A1
ccc
C
DETAIL Y
SECT W-W
c
c1
b1
b
C
A
S
aaa
M
A
B
Y
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